Texas Instruments to Support Microsoft to Build IoT with Embedded Processors

[Chinese instrumentation network enterprise vane] Texas Instruments announced three low-cost evaluation kits based on TI's embedded processors that will support the Microsoft Azure IoT Verification Suite. TI leads other semiconductor manufacturers and combines a wireless microcontroller and processor-based certification evaluation kit with the Microsoft Azure IoT build kit to help developers in IoT application development in just a few minutes.
In the TI Low Power SimpleLink Wi-Fi CC3200 wireless MCU LaunchPad suite, as well as in the BeagleBone Black and BeagleBoard Green suites based on the Sitara AM335x processor, the verification code for the Microsoft Azure IoT family of products has been pre-imported, which developers can expect TI's products will add more certification in the coming months.

Microsoft's program can determine whether the hardware is compatible with the Azure IoT suite, allowing developers who purchase TI's low-cost development kits to easily download the appropriate Microsoft Azure IoT authentication and quickly connect to the cloud.

TI suites certified by Microsoft Azure IoT:

SimpleLink Wi-Fi CC3200 wireless MCU LaunchPad kit creates low-power and secure cloud connectivity;

The BeagleBone Black development board uses a TI Sitara AM335x processor with a 1GHz ARM Cortex-A8 core, and supports Wi-Fi connectivity via Ethernet via the TI WiLinkTM 8 Wi-Fi Bluetooth combo and connectivity module.

The SeeedStudio BeagleBone Green development board is based on the BeagleBone Black and adds connectivity to the Grove Sensor family.

Barb Edson, general manager of Microsoft's data platform and Internet of Things, said that Microsoft is honored to include TI in the first Azure IoT authentication to make it easier and faster for customers to build TI-based cloud networking products under these certifications. , Microsoft will further work closely with TI to allow more industrial, automotive and consumer applications to obtain Microsoft Azure IoT authentication.

The innovation of semiconductor is based on the connection between people and things in the Internet of Things and the cloud. TI's innovations are to produce battery-powered networking products from wired to wireless connections, reduce power consumption, reduce system costs through integration, provide modules, and Pre-integrated network software stacks, and improve information security, further realize the Internet of Things.

The widest range of IoT node and gateway product lines, from wired and wireless connectivity, microcontrollers, processors, sensing technology, power management to analog solutions, plus an ecosystem of cloud-based services to assist customers For faster connection to the cloud, TI is incorporating Microsoft Azure into the TI IoT cloud ecosystem. This is a selected group of organizations that can support various TI devices and quickly and easily connect to the cloud.

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